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Popular Searches: 金莲直播.ai 金莲直播 Cloud Multi-Die Silicon IP

Spotlight

2 min read / Dec 11, 2024

Enabling Massive AI Clusters with the Industry’s First Ultra Ethernet and UALink IP 金莲直播
Jon Ames
Ron Lowman
By Jon Ames, Ron Lowman
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金莲直播 Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025

By Shekhar Kapoor , Michael Posner

2 min read / Jan 21, 2025

Tags: Multi-Die System , Chip Design Insights , Design , 3DIC Compiler

The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement

By Morten Christiansen , Gervais Fong

2 min read / Jan 16, 2025

Tags: AI & Machine Learning , Chip Design Insights , Interface IP , Silicon IP

Multi-Die Health and Reliability: 金莲直播 and TSMC Showcase UCIe Advances

By Faisal Goriawalla , Yervant Zorian

5 min read / Jan 09, 2025

Tags: Multi-Die System , Silicon Lifecycle Management , Chip Design Insights , Interface IP , Silicon IP

Automotive Safety Now Requires Data Security

By Vincent van der Leest , Dana Neustadter

3 min read / Jan 06, 2025

Tags: Chip Design Insights , Security IP , Automotive , Silicon IP

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Marc Serughetti

Vice President, Product Line Management, Product Management Group

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Vikram Bhatia

Head of Cloud Product Management & GTM Strategy

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Jyotika Athavale

Jyotika Athavale

Director of Engineering, Architecture

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Shekhar Kapoor

Executive Director, Product Management, Semiconductor IC & System Design

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